Balhoofd
Christian Wells
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发布时间:2026-01-16 10:58:14
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Device Type K1C Material Material PLA Quality Layer Height 0.20mm Line Width 0.45mm Shell Hide Z Seam Yes Wall Thickness 2.40mm Top/Bottom Thickness 2.00mm Infill Infill Pattern Grid Infill Density 35.00% Speed Print Speed 80.0mm/s Initial Layer Speed 40.0mm/s Travel Speed 120.0mm/s Temperature Nozzle TEMP 210.00°C Hotbed TEMP 50.00°C Travel Enable Retraction Yes Retraction Distance 0.60mm Retraction Speed 35.00mm/s Support Generate Support Yes Support Placement Everywhere Support Pattern Lines Infill Density 12.00% Support Overhang Angle 55.0° Build Plate Adhesion Build Plate Adhesion Brim Vase Mode Vase Mode No Ironing Ironing No
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