This mounts between two sections of solderless breadboard to allow using carrier boards or modules with a wide row spacing, for example an ESP32 module.

Includes dovetail slots/pegs to fit the solderless breadboards I have

(should be standard, but I include the FreeCAD file if you need to re-design).

I used PLA at 205C/55C, 0.2mm layer height, 1.2mm walls, 0.8mm top/bottom, 20% infill with a 0.4mm nozzle.

Inspired by Hackaday article "The Solution To Oversized Dev Boards: A Literal Hack" https://hackaday.com/2018/08/27/the-solution-to-oversized-dev-boards-a-literal-hack/

Designed in FreeCAD 0.17, sliced in Cura 3.4.1, printed on a Prusa clone using OctpPi

Category: Electronics