When making a diy circuit board, you may venture into applying solder masks so when you go to put everything together you don't accidently short things out.  One approach is to cure the mask first, then use a laser or milling operation at 0 Z to remove the mask near the pads.  That's great when everything comes together but you have two competing compromises, manual drilling of holes and clean pads or clean drilling of holes and potentially no pads. This is the result of an experiment where I tried to wipe off the mask before curing it.  It's functional, but not perfect.

Print with auto tree supports, never mind the spiral geometry, unless you have a great machine that won't show up in any detail.  I printed at full speed and it came out fine.

Insert broken 3mm cnc bit, use a lighter to heat it up with it's tight, crazy glue if it's loose. Nudge it around to make sure it compresses.  From flatcam or something similar when creating the pad paint operation, have the spindle speed at 100 or something, not sure you even need it to rotate, just jog to the surface of the board and go a smidge further, the plastic "spring" should allow for a mm or so.

Feel free to use multiple passes and cure a bit and do some more.