Cant find any OrangePi Plus2E board I/O and board dimensions from anywhere. So manual measure and design a simple case. And use bluebomber's Star wars Pattern Fan Guard design for fan guard.

Case should be able to snap in place without screw. But recommend to secure both top and bottom case with screw.

screw needed:

M2.5 10 or M3 10 for 40mm 10mm fan mount or Glue in place
M2.5 16 to secure Top and Bottom case

Active fan cooling and an alu heat-sink are needed, if case are make of PLA. As the H3 chip will be very hot under heavy load, the chip can hit 80 degrees C with heat-sink on.

If plan not to have active fan cooling, recommend to print with ABS, ASA, PETG.

Anycubic kossel min K2

Doesn't Matter

Doesn't Matter

0.2

10%

PLA or ABS or ASA or PETG

nozzle 0.4
for light post-process (light sanding)
Bottom/Top Layer 4
Wall 3

for heavy post-process (heavy sanding)
Bottom/Top Layer 10
Wall 4