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게시일:2026-07-06 05:30:16
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Device Type K1C Material Material PLA Quality Layer Height 0.20mm Line Width 0.42mm Shell Hide Z Seam Yes Wall Thickness 1.68mm Top/Bottom Thickness 1.20mm Infill Infill Pattern Lines Infill Density 100.00% Speed Print Speed 150.0mm/s Initial Layer Speed 75.0mm/s Travel Speed 120.0mm/s Temperature Nozzle TEMP 220.00°C Hotbed TEMP 45.00°C Travel Enable Retraction Yes Retraction Distance 0.80mm Retraction Speed 30.00mm/s Support Generate Support No Build Plate Adhesion Build Plate Adhesion Brim Vase Mode Vase Mode No Ironing Ironing No Fold
