Device Type Device Type K1C Material Material PLA Quality Layer Height 0.20mm Line Width 0.42mm Shell Hide Z Seam Yes Wall Thickness 0.87mm Top/Bottom Thickness 0.80mm Infill Infill Pattern Grid Infill Density 15.00% Speed Print Speed 300.0mm/s Initial Layer Speed 60.0mm/s Travel Speed 500.0mm/s Temperature Nozzle TEMP 230.00°C Hotbed TEMP 45.00°C Travel Enable Retraction Yes Retraction Distance 0.80mm Retraction Speed 30.00mm/s Support Generate Support No Build Plate Adhesion Build Plate Adhesion Simple Raft Vase Mode Vase Mode No Ironing Ironing No