Backshell for a passive SFP+ module cooling solution. The model has to be tolerating temperature up to 80 °C. After prototyping with PLA, I ordered the model with reinforced ASA. The SFP+ extension is from 10Gtek (https://www.10gtek.com/immersion). I ordered the 30cm one which is almost to long and looses 0.5 V on the cable. So next time I would select the shortest one.

Other components needed:

1. 10Gtek “CVT-S/S-Cage-030” or better a shorter one. https://store.10gtek.com/10cmsfp-to-sfp-cage-with-3m-flat-cable-in-nylon-jacket-oem-code/p-20017 
2. Würth Elektronik 40013020 Thermally Conductive Gap Pad 2mm https://www.mouser.ch/ProductDetail/710-40013020 
3. Wakefield-Vette 537-95AB OR 547-95AB standard quarter brick cooler https://www.mouser.ch/ProductDetail/567-537-95AB https://www.mouser.ch/ProductDetail/567-547-95AB 
4. 4x M3x6 or M3x8 screws suitable for thermoplastics. (Holes are 2.4mm)

The cooler shall be selected depending on the mounted orientation. I used the 537 series in the picture.

If you want to use conductive materials like carbon reinforced ABS, add a thin layer of Kapton tape to the contact surface with the PCB.

I currently use the Mikrotik S+RJ10 SFP+ modules with a RJ45 port. They use older chipsets inside, like most low cost SFP+ modules. In high temperature environments, it may be preferable to use something more modern like the fs.com https://www.fs.com/products/154927.html module, that only uses ≤1.8W instead of the typical 2.7 W. Have not yet tested compatibility.