ESP32-C3 OLED enclosure

This is a product designed forESP32-C3 OLEDA 3D-printed case custom-designed for development boards. This case is precision-engineered and fully functional, making it ideal for compact IoT projects.

Main features:

• Safety buckle design:The board can be perfectly "snapped" into place. It is designed for a very tight and secure installation
• Double-version cover plate:*Standard cover plates:It is suitable for a neat and closed appearance.
  • Cable penetration cover plate:Specifically designed for projects that require external wiring or sensor connections.
• Optimize for high quality:To achieve the best results and ensure that the snap mechanism works properly, I recommend using a lower floor height0.08mmor0.16mm) to print it.
• Recommended materials:
  • White PLA:It is suitable for a simple and classic aesthetic
  • Transparent PLA:This is the ideal choice if you want to see the internal components or status LEDs through the casing.

Printing tips:

• Floor height:0.08mm
• Materials:PLA / PLA+
• Ironing:I suggest enabling "Ironing" on all top surfaces to give the panels a smooth and professional finish.